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Electromigration Modeling at Circuit Layout Level

Electromigration Modeling at Circuit Layout Level Image

Book Details:

Publisher:Springer
Series: Springer
Author:Cher Ming Tan
Edition:1
ISBN-10:9814451207
ISBN-13:9789814451208
Pages:120
Published:May 04 2013
Posted:Nov 19 2014
Language:English
Book format:PDF
Book size:4.98 MB

Book Description:

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

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